The (US)² – Ultrasound and Signal group relies on a set of specialized equipment to design, manufacture, characterize, and validate new ultrasound technologies. These infrastructures cover the entire development chain: from transducer modeling (COMSOL, MATLAB, Python, Field II, k-Wave, etc.) to real-time imaging (Verasonics, CUDA, FPGA), including probe micromanufacturing, acoustic measurements in air or in immersion, and integration on embedded platforms. All this equipment is available for rental through the Centre de Recherche Acoustique Signal Humain (CRASH-UdeS) and the Plateforme d’instrumentation en mécanique de l’Université de Sherbrooke (PIMUS), fostering collaborations between fundamental research, applied projects, and industrial partnerships.
– Verasonics Vantage system LF 128 channels
– Verasonics Vantage 256 + HIFU
– 2D and 3D ultrasound probes (GE, ATL)
– custom ultrasound transducers and arrays
- CIRS multi-purpose ultrasound phantoms
- GPU platforms for real-time imaging
- CUDA devlopment platforms for embedded imaging
– Immersion tank TDNDE 36″ × 36″ × 23″
– Collaborative robotic arm Universal Robots UR-5e
– hydrophones (Needle, Fibre-Optic, Membrane) and preamplifiers (ONDA)
– Power amplifiers (E&I 400 W, TREK 2100HF) for ultrasound applications
– LPKF laser micro-machining system
- Piezoceramic dicing and additive manufacturing
- specialized equipment for molding, assembly and array manufacturing
- 3D printers for resin, continuous fibers, biomaterials
- PCB printer
– 3D laser vibrometer Polytec PSV-500 – 25 MHz with close-up unit
-microphones, acoustic and ultrasound sources, contact and immersion probes
– NI-FPGA, NI-DAQMX and NI-PCIe plateforms with I/O > 100 MHz
– Multichannel acquisition systems (Pragma PA-UT 32/128 / NI 64 canaux)
